Cerium Oxide Polishing Powder 0.7-1.1um
DESCRIPTION:
Cerium Oxide Polishing Powder 0.7-1.1um is a high-purity, submicron abrasive material based on cerium oxide (CeO₂, also called ceria). It gains unique chemical and mechanical polishing mechanism. Cerium oxide wafer polishing powder is widely used in the precision polishing of semiconductor wafers, optical components, and electronic substrates. It is suitable for making wafer polishing slurry.
Properties of Cerium Oxide Polishing Powder 0.7-1.1um:
| CAS No. | 1306-38-3/1312-81-8 |
| Formula | Cerium Oxide(CeO2)/Lanthanum oxide(La2O3) |
| Appearance | White color Powder |
| ENS NO. | 215-150-4/215-200-5 |
| True Density | 6.5-7 g/cm3 |
| Melting Point | 2400 Centigrade |
| Boiling Point | 3500 Centigrade |
TYPICAL CHEMICAL ANALYSIS [%]:
| Item | Guarantee Value | Typical Value | |
| REO | ≥94 | 94.42 | |
| Rare earth impurities/REO | La2O3 | 32-36 | 34.94 |
| CeO2 | 64-68 | 64.57 | |
| Pr6O11 | ≤0.2 | 0.007 | |
| Nd2O3 | ≤0.2 | 0.002 | |
| Non rare earth impurities | Fe2O3 | ≤0.04 | 0.033 |
| Al2O3 | ≤0.5 | 0.289 | |
| CaO | ≤1.5 | 0.04 | |
| MgO | ≤0.5 | 0.104 | |
| SiO2 | ≤0.1 | 0.019 | |
APPLICATIONS :
used for high-precision grinding and polishing of optical glass, integrated circuit substrate glass, electroplating substrate glass, high-precision optical lens, camera lens, aircraft toughened glass, various display glass and other products of more than 10 specifications and models. It can also be
used in water drill, hot drill, glass jewelry, etc.
Package:
